Rapid Increase of the Application related to Semiconductor Wafer Polishing Equipment.
As the circuit pattern of semiconductor is getting finer and finer and the wafer area is being broadened, the patent applications related to the semiconductor polishing equipment(CMP)are increasing rapidly.According to the KIPO, the foreign applications were reduced from 28 in 2000 year to 18 in 2002 year, but the domestic<
